US Patent Issued to Samsung Display on Nov. 3 for "Chip on film package" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,786, issued on Nov. 3, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea).

"Chip on film package" was invented by Wontae Kim (Yongin-si, South Korea) and Jae-Han Lee (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip on film package includes a base substrate including a driving chip area including a first side and a second side facing the first side, first areas covering ends of the first side of the driving chip area and including first bent portions, and a second area covering the second side of the driving chip area, a driving chip disposed on a first surface of the base substrate in the driving chip area,...