US Patent Issued to GlobalFoundries U.S. on Nov. 3 for "Structure including moisture barrier along input/output opening and related method" (New York Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,784, issued on Nov. 3, was assigned to GlobalFoundries U.S. Inc. (Malta, N.Y.).

"Structure including moisture barrier along input/output opening and related method" was invented by Zhuojie Wu (Port Chester, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A structure includes an integrated circuit chip in a substrate, and an I/O opening extending inwardly from an edge of the integrated circuit chip. A dielectric moisture barrier includes a first portion extending along a side of the I/O opening, a second portion extending along the edge of the integrated circuit chip, and a third portion coupling the first moisture barrier portion to the second mo...