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US Patent Issued to NEXTIN on Nov. 3 for "Semiconductor manufacturing apparatus" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,682, issued on Nov. 3, was assigned to NEXTIN INC. (Gyeonggi-do, South Korea). "Semiconductor manufacturing apparatus" was invented by Seoun... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 3 for "Wafer-level die-transfer tool and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,683, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Wafer-level die-transfer tool and... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Chip ejecting apparatus and method" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,684, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Chip ejecting apparatus and method" was invent... Read More


US Patent Issued to CANON on Nov. 3 for "Apparatus including a non-contact die head and a substrate chuck and a method of using the same" (Texas Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,685, issued on Nov. 3, was assigned to CANON K.K. (Tokyo). "Apparatus including a non-contact die head and a substrate chuck and a method of... Read More


US Patent Issued to KOKUSAI ELECTRIC on Nov. 3 for "Gas supplier, processing apparatus, and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,686, issued on Nov. 3, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo). "Gas supplier, processing apparatus, and method of manufacturing semi... Read More


US Patent Issued to ASM IP Holding on Nov. 3 for "Vessel for containing precursor" (Dutch Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,687, issued on Nov. 3, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Vessel for containing precursor" was invented by Herbert ... Read More


US Patent Issued to Tokyo Electron on Nov. 3 for "Substrate processing apparatus and temperature regulation method" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,688, issued on Nov. 3, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing apparatus and temperature regulation method" was i... Read More


US Patent Issued to Yield Engineering Systems on Nov. 3 for "Solder reflow with optical endpoint control" (American, Indian Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,689, issued on Nov. 3, was assigned to Yield Engineering Systems Inc. (Fremont, Calif.). "Solder reflow with optical endpoint control" was i... Read More


US Patent Issued to KOKUSAI ELECTRIC on Nov. 3 for "Substrate processing apparatus, apparatus start-up method, method of manufacturing semiconductor device, and recording medium for determining the need for authentication at start-up of a controller of the substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,690, issued on Nov. 3, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo). "Substrate processing apparatus, apparatus start-up method, method of... Read More


US Patent Issued to SCREEN HOLDINGS on Nov. 3 for "Control assistance device and control assistance method" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,691, issued on Nov. 3, was assigned to SCREEN HOLDINGS Co. LTD. (Japan). "Control assistance device and control assistance method" was inven... Read More