US Patent Issued to CANON on Nov. 3 for "Apparatus including a non-contact die head and a substrate chuck and a method of using the same" (Texas Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,685, issued on Nov. 3, was assigned to CANON K.K. (Tokyo).

"Apparatus including a non-contact die head and a substrate chuck and a method of using the same" was invented by Byung-Jin Choi (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus can include a pick-up head including a non-contact die chuck for holding a die; a substrate chuck having a non-planar chucking surface configured to hold a source substrate; and a substrate retention module that is configured to provide a force in a direction from the source substrate toward the substrate chuck, wherein the force is sufficient to deform the source substrate. A method of using...