ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,684, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Chip ejecting apparatus and method" was invented by Jae Ryoung Lee (Suwon-si, South Korea), Jae Kun Shin (Suwon-si, South Korea) and Dong Jun Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip ejecting apparatus may include: a wafer stage configured to receive a dicing tape and a plurality of chips attached to the dicing tape; an ejector under the wafer stage, the ejector configured to eject gas toward a lower surface of the dicing tape while being in a non-contact state with the dicing tape; an orthogonal robot under the wafer ...