ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,832, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and method of fabri... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,833, issued on Nov. 3, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Interconnect substrate, method of making the sa... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,834, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Manufacturing method of package struc... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,835, issued on Nov. 3, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Bonded structure with interconnect... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,836, issued on Nov. 3, was assigned to SEOUL VIOSYS Co. LTD. (Ansan-si, South Korea). "Light emitting device having cantilever electrode, LE... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,837, issued on Nov. 3, was assigned to FASFORD TECHNOLOGY Co. LTD. (Minami-Alps, Japan). "Dipping apparatus, die bonding apparatus, and manu... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,838, issued on Nov. 3, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan). "Chip package structure and method for p... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,840, issued on Nov. 3, was assigned to CANON MACHINERY INC. (Shiga, Japan). "Position alignment device, position alignment method, bonding d... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,841, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package having a blocking layer ... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,842, issued on Nov. 3, was assigned to BEIJING YOUZHUJU NETWORK TECHNOLOGY Co. LTD. (Beijing). "Chip and method for forming the same, and pa... और पढ़ें