US Patent Issued to SHINKO ELECTRIC INDUSTRIES on Nov. 3 for "Interconnect substrate, method of making the same, and semiconductor apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,833, issued on Nov. 3, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).

"Interconnect substrate, method of making the same, and semiconductor apparatus" was invented by Kensuke Uchida (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnect substrate includes an interconnect layer, an insulating layer covering the interconnect layer, an electrode disposed on an upper surface of the interconnect layer and protruding from an upper surface of the insulating layer, and a groove formed in the upper surface of the insulating layer around the electrode, wherein the electrode includes a first portion whose side surfac...