ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,778, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Methods, systems, apparatus, and articles of manufacture to cool ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,779, issued on Nov. 3, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China). "Memories and fabrication methods thereof, memor... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,780, issued on Nov. 3, was assigned to INVENTEC (PUDONG) TECHNOLOGY Corp. (Shanghai) and INVENTEC Corp. (Taipei City, Taiwan). "Heat dissipa... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,781, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Cheol K... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,782, issued on Nov. 3, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor device" was invented by Yoichi Sasaki (Kariya-city, ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,783, issued on Nov. 3, was assigned to X-Celeprint Ltd. (Dublin). "Micro-transfer-printable component modules with a module tether and micro... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,784, issued on Nov. 3, was assigned to GlobalFoundries U.S. Inc. (Malta, N.Y.). "Structure including moisture barrier along input/output ope... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,785, issued on Nov. 3, was assigned to HUNAN SAN'AN SEMICONDUCTOR Co. LTD. (Changsha, China). "Semiconductor device and method of making the... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,786, issued on Nov. 3, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Chip on film package" was invented by Wontae Kim ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,787, issued on Nov. 3, was assigned to MediaTek Inc. (Hsinchu City, Taiwan). "Semiconductor devices with in-package PGS for coupling noise s... Read More