US Patent Issued to INVENTEC (PUDONG) TECHNOLOGY, INVENTEC on Nov. 3 for "Heat dissipation assembly" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,780, issued on Nov. 3, was assigned to INVENTEC (PUDONG) TECHNOLOGY Corp. (Shanghai) and INVENTEC Corp. (Taipei City, Taiwan).

"Heat dissipation assembly" was invented by Ming Tsung Liu (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation assembly comprises a casing, a pushed member, a plug and a phase change fluid. The casing has a first fluid space, a second fluid space and a communication channel. The first fluid space and second fluid space are in fluid communication with each other by the communication channel. A first end of the pushed member is fixed to the casing. The plug is movably disposed in the casing an...