US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Adhesive tape sheet, method of manufacturing the same and method of manufacturing semiconductor devices using the same" (South Korean Inventors)

Posted On: 2026-11-03

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,708, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Adhesive tape sheet, method of manufacturing t... Read More

US Patent Issued to INNOX Advanced Materials on Nov. 3 for "Adhesive sheet for semiconductor device" (South Korean Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,709, issued on Nov. 3, was assigned to INNOX Advanced Materials Co. Ltd. (Asan-si, South Korea). "Adhesive sheet for semiconductor device" w... Read More

US Patent Issued to SCREEN HOLDINGS on Nov. 3 for "Substrate processing device and substrate processing method" (Japanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,710, issued on Nov. 3, was assigned to SCREEN HOLDINGS Co. LTD. (Japan). "Substrate processing device and substrate processing method" was i... Read More

US Patent Issued to NITERRA on Nov. 3 for "Substrate holder and method of producing substrate holder" (Japanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,711, issued on Nov. 3, was assigned to NITERRA Co. LTD. (Nagoya, Japan). "Substrate holder and method of producing substrate holder" was inv... Read More

US Patent Issued to SEMES on Nov. 3 for "Transport hand ring transport system using the same" (South Korean Inventor)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,712, issued on Nov. 3, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea). "Transport hand ring transport system using the same" was i... Read More

US Patent Issued to Applied Materials Israel on Nov. 3 for "Hybrid vacuum electrostatic chuck carrier for high warpage wafers" (Israeli Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,713, issued on Nov. 3, was assigned to Applied Materials Israel Ltd. (Rehovot, Israel). "Hybrid vacuum electrostatic chuck carrier for high ... Read More

US Patent Issued to Tokyo Electron on Nov. 3 for "Contactless wafer positioning carrier design" (Florida, Texas, New York Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,714, issued on Nov. 3, was assigned to Tokyo Electron Ltd. (Tokyo). "Contactless wafer positioning carrier design" was invented by Henry Jim... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING, TSMC CHINA on Nov. 3 for "Wafer manufacturing system and method for manufacturing wafers" (Chinese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,715, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and TSMC CHINA COMPANY Ltd. (Shangha... Read More

US Patent Issued to FUJI ELECTRIC on Nov. 3 for "Method of manufacturing semiconductor device by forming aluminum alloy film and removing possible defects in semiconductor chips" (Japanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,716, issued on Nov. 3, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Method of manufacturing semiconductor device by forming al... Read More

US Patent Issued to Applied Materials on Nov. 3 for "Influence function-based mitigation of substrate deformation with film deposition and ion implantation" (California, Massachusetts, Maine Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,717, issued on Nov. 3, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Influence function-based mitigation of substrate defor... Read More

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US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Adhesive tape sheet, method of manufacturing the same and method of manufacturing semiconductor devices using the same" (South Korean Inventors)

US Patent Issued to INNOX Advanced Materials on Nov. 3 for "Adhesive sheet for semiconductor device" (South Korean Inventors)

US Patent Issued to SCREEN HOLDINGS on Nov. 3 for "Substrate processing device and substrate processing method" (Japanese Inventors)

US Patent Issued to NITERRA on Nov. 3 for "Substrate holder and method of producing substrate holder" (Japanese Inventors)

US Patent Issued to SEMES on Nov. 3 for "Transport hand ring transport system using the same" (South Korean Inventor)

US Patent Issued to Applied Materials Israel on Nov. 3 for "Hybrid vacuum electrostatic chuck carrier for high warpage wafers" (Israeli Inventors)

US Patent Issued to Tokyo Electron on Nov. 3 for "Contactless wafer positioning carrier design" (Florida, Texas, New York Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING, TSMC CHINA on Nov. 3 for "Wafer manufacturing system and method for manufacturing wafers" (Chinese Inventors)

US Patent Issued to FUJI ELECTRIC on Nov. 3 for "Method of manufacturing semiconductor device by forming aluminum alloy film and removing possible defects in semiconductor chips" (Japanese Inventors)

US Patent Issued to Applied Materials on Nov. 3 for "Influence function-based mitigation of substrate deformation with film deposition and ion implantation" (California, Massachusetts, Maine Inventors)