US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Adhesive tape sheet, method of manufacturing the same and method of manufacturing semiconductor devices using the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,708, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Adhesive tape sheet, method of manufacturing the same and method of manufacturing semiconductor devices using the same" was invented by Hansol Yoo (Suwon-si, South Korea) and Wonkeun Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An adhesive tape sheet includes a dicing tape having an attachment region extending along an outer circumference thereof so as to be attached to a ring frame used when dicing a wafer, an adhesive film on the dicing tape radially inside of an inner boundary of the attachment region and to which the wafer is...