Exclusive

Publication

Byline

Location

US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Module tray cover and semiconductor device case including the same" (South Korean Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,698, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Module tray cover and semiconductor device cas... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Rotational interface, carrier transfer system including the same, and semiconductor manufacturing method using the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,699, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Rotational interface, carrier transfer system ... Read More


US Patent Issued to Daifuku on Nov. 3 for "Transport vehicle comprising a first holder member, a second holder member, and a holder drive below a support" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,700, issued on Nov. 3, was assigned to Daifuku Co. Ltd. (Osaka, Japan). "Transport vehicle comprising a first holder member, a second holder... Read More


US Patent Issued to Applied Materials Israel on Nov. 3 for "Substrate pre-aligner" (Israeli Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,701, issued on Nov. 3, was assigned to Applied Materials Israel Ltd. (Rehovot, Israel). "Substrate pre-aligner" was invented by Itamar Orenb... Read More


US Patent Issued to KOREA ATOMIC ENERGY RESEARCH INSTITUTE on Nov. 3 for "Semiconductor chip alignment apparatus and method for packaging" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,702, issued on Nov. 3, was assigned to KOREA ATOMIC ENERGY RESEARCH INSTITUTE (Daejeon, South Korea). "Semiconductor chip alignment apparatu... Read More


US Patent Issued to Movensys on Nov. 3 for "Automatic alignment of overhead transport vehicles to load ports of semiconductor fabrication tools" (Massachusetts Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,703, issued on Nov. 3, was assigned to Movensys Corp. (Somerville, Mass.). "Automatic alignment of overhead transport vehicles to load ports... Read More


US Patent Issued to Tokyo Electron on Nov. 3 for "Substrate processing apparatus and control position setting method" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,704, issued on Nov. 3, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing apparatus and control position setting method" was... Read More


US Patent Issued to NGK INSULATORS on Nov. 3 for "Member for semiconductor manufacturing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,705, issued on Nov. 3, was assigned to NGK INSULATORS Ltd. (Nagoya, Japan). "Member for semiconductor manufacturing apparatus" was invented ... Read More


US Patent Issued to Entegris on Nov. 3 for "Electrostatic chuck with reduced charge injection into dielectric layer" (Massachusetts Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,706, issued on Nov. 3, was assigned to Entegris Inc. (Billerica, Mass.). "Electrostatic chuck with reduced charge injection into dielectric ... Read More


US Patent Issued to BESI Switzerland on Nov. 3 for "Die ejector" (Swiss Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,707, issued on Nov. 3, was assigned to BESI Switzerland AG (Steinhausen, Switzerland). "Die ejector" was invented by Fabian Hurschler (Stein... Read More