ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,704, issued on Nov. 3, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and control position setting method" was invented by Ryoya Tominaga (Iwate, Japan), Akashi Fujio (Iwate, Japan), Masami Dodo (Iwate, Japan), Gaku Watanabe (Iwate, Japan) and Hiroyuki Wada (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a vacuum container, a rotary table, a stage, a lifter, and a controller that controls an operation of the lifter. The controller automatically sets a control position in the operation of the lifter. The controller, in (A), repeatedly raises the lifter by a first ...