ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,702, issued on Nov. 3, was assigned to KOREA ATOMIC ENERGY RESEARCH INSTITUTE (Daejeon, South Korea).
"Semiconductor chip alignment apparatus and method for packaging" was invented by Chang Goo Kang (Gwangju, South Korea), Jeong Min Park (Hwaseong-si, South Korea) and Su Jin Kim (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed in the present document is an apparatus for aligning a semiconductor chip for packaging according to an embodiment, the apparatus may include a radiation source configured to irradiate a plurality of semiconductor chips with radiation; the plurality of semiconductor chips vertically disposed with res...