ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,009, issued on Aug. 4, was assigned to nD-HI Technologies Lab Inc. (Taipei City, Taiwan). "Semiconductor device and manufacturing method the... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,010, issued on Aug. 4, was assigned to MENTIUM TECHNOLOGIES INC. (Santa Barbara, Calif.). "Radiation shielding of electronics using artifici... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,011, issued on Aug. 4, was assigned to Micron Technology Inc. (Boise, Idaho). "Antenna protection on dummy metal fills" was invented by Hao ... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,012, issued on Aug. 4, was assigned to LG Display Co. Ltd. (Seoul, South Korea). "Display device" was invented by Jihyeon Hwang (Paju-si, So... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,013, issued on Aug. 4, was assigned to Analog Devices International UnLtd. Co. (Limerick, Ireland). "Antenna package having a laminate subst... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,014, issued on Aug. 4, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "High-frequency module" was invented by Kiyoshi Ai... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,015, issued on Aug. 4, was assigned to Murata Manufacturing Co. Ltd. (Kyoto-fu, Japan). "Semiconductor device" was invented by Masao Kondo (... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,016, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package with horizontally spaced... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,017, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device and semiconductor chip... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,018, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Method of marking semiconductor package" was i... Read More