US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Semiconductor device and semiconductor chip" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,017, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor device and semiconductor chip" was invented by Jimin Choi (Suwon-si, South Korea), Joongwon Shin (Suwon-si, South Korea), Sungyun Woo (Suwon-si, South Korea), Yeonjin Lee (Suwon-si, South Korea), Jongmin Lee (Suwon-si, South Korea) and Sehyun Hwang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device may include a plurality of chip regions on a substrate, at least one scribe lane surrounding each of the plurality of chip regions on the substrate, a plurality of first align key patterns and a plurality ...