ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,013, issued on Aug. 4, was assigned to Analog Devices International UnLtd. Co. (Limerick, Ireland).
"Antenna package having a laminate substrate" was invented by Santosh Kudtarkar (Ayer, Mass.) and Islam A. Eshrah (Cairo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A radio frequency stacked die assembly can include a laminate substrate with a layer of conductive traces between a first plurality of laminate layers. The stacked die assembly can include surface mount antenna packages mounted to an exterior surface of the substrate, each antenna package including a radio frequency patch antenna embedded within a second plurality of laminate layers. The...