US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Semiconductor package with horizontally spaced chip and interposer substrate" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,016, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package with horizontally spaced chip and interposer substrate" was invented by Taejun Jeon (Suwon-si, South Korea), Junwoo Park (Suwon-si, South Korea), Yongkwan Lee (Suwon-si, South Korea), Seung Hwan Kim (Suwon-si, South Korea) and Jongwan Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including: a first substrate; a first semiconductor chip and a second substrate horizontally spaced apart from each other on the first substrate; and a molding layer on the first substrate, the first semicondu...