US Patent Issued to Murata Manufacturing on Aug. 4 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,015, issued on Aug. 4, was assigned to Murata Manufacturing Co. Ltd. (Kyoto-fu, Japan).

"Semiconductor device" was invented by Masao Kondo (Nagaokakyo, Japan), Satoshi Goto (Nagaokakyo, Japan), Takayuki Tsutsui (Nagaokakyo, Japan) and Shinnosuke Takahashi (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stacked semiconductor device capable of increasing heat dissipation comprises a first member and a second member. The first member includes a semiconductor substrate and a first electronic circuit. The first electronic circuit includes a semiconductor element provided on one surface of the semiconductor substrate. A second member is...