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US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Tunable W-shaped profile for structures" (Taiwanese Inventors)

पोस्टेड ऑन: 2026-08-12
Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,958, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Tunable W-shaped profile for st... और पढ़ें

US Patent Issued to Sandisk Technologies on Aug. 11 for "Three-dimensional memory device containing dummy via cavities and method for making same" (Japanese Inventors)

पोस्टेड ऑन: 2026-08-12
Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,959, issued on Aug. 11, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Three-dimensional memory device containing dummy via... और पढ़ें

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Method of forming a cap layer for sealing an air gap, and semiconductor device" (Taiwanese Inventor)

पोस्टेड ऑन: 2026-08-12
Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,961, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method of forming a cap layer f... और पढ़ें

US Patent Issued to Tencent Technology, SUZHOU INSTITUTE OF NANO-TECH & NANO-BIONICS (SINANO) CHINESE ACADEMY OF SCIENCES on Aug. 11 for "Air bridge structure and manufacturing method thereof, and superconducting quantum chip and manufacturing method thereof" (Chinese Inventors)

पोस्टेड ऑन: 2026-08-12
Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,962, issued on Aug. 11, was assigned to Tencent Technology Co. Ltd. (Shenzhen, China) and SUZHOU INSTITUTE OF NANO-TECH & NANO-BIONICS (SINA... और पढ़ें

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Semiconductor devices including backside capacitors and methods of manufacture" (Taiwanese Inventors)

पोस्टेड ऑन: 2026-08-12
Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,963, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor devices including bac... और पढ़ें

US Patent Issued to Adeia Semiconductor Bonding Technologies on Aug. 11 for "Stacked inductors in multi-die stacking" (California, North Carolina Inventors)

पोस्टेड ऑन: 2026-08-12
Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,964, issued on Aug. 11, was assigned to Adeia Semiconductor Bonding Technologies Inc (San Jose, Calif.). "Stacked inductors in multi-die st... और पढ़ें

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Semiconductor device structure having a multi-layer conductive feature and method making the same" (Taiwanese Inventors)

पोस्टेड ऑन: 2026-08-12
Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,965, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Semiconductor device structure havi... और पढ़ें

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Semiconductor device" (Taiwanese Inventors)

पोस्टेड ऑन: 2026-08-12
Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,966, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device" was invented ... और पढ़ें

US Patent Issued to Micron Technology on Aug. 11 for "Semiconductor device assemblies including monolithic silicon structures for thermal dissipation and methods of making the same" (Idaho Inventor)

पोस्टेड ऑन: 2026-08-12
Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,967, issued on Aug. 11, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor device assemblies including monolithic silico... और पढ़ें

US Patent Issued to INVENTION AND COLLABORATION LABORATORY on Aug. 11 for "Heat removing layer surrounding a transistor" (Taiwanese Inventors)

पोस्टेड ऑन: 2026-08-12
Government News US Fed News Patentwipo

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,968, issued on Aug. 11, was assigned to INVENTION AND COLLABORATION LABORATORY INC. (Taipei City, Taiwan). "Heat removing layer surrounding... और पढ़ें