Exclusive

Publication

Byline

Location

US Patent Issued to UNITED MICROELECTRONICS on June 30 for "Capacitor on fin structure and fabricating method of the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,340, issued on June 30, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Capacitor on fin structure and fabricating ... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on June 30 for "Nanosheet devices and methods of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,341, issued on June 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Nanosheet devices and methods of fa... Read More


US Patent Issued to TEXAS INSTRUMENTS on June 30 for "Integrated boot diode with high forward bias capability" (Texas, North Carolina Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,342, issued on June 30, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Integrated boot diode with high forward bias capability" was inve... Read More


US Patent Issued to Infineon Technologies Austria on June 30 for "RC-IGBT and manufacturing method of RC-IGBT" (German Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,343, issued on June 30, was assigned to Infineon Technologies Austria AG (Villach, Austria). "RC-IGBT and manufacturing method of RC-IGBT" ... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 30 for "Integrated circuit structure and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,344, issued on June 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Integrated circuit structure an... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING, NATIONAL YANG MING CHIAO TUNG UNIVERSITY on June 30 for "Semiconductor device and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,345, issued on June 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and NATIONAL YANG MING CHIAO TUNG ... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 30 for "Method for forming source/drain contacts" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,346, issued on June 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Method for forming source/drain con... Read More


US Patent Issued to Intel on June 30 for "Lower device access in stacked transistor devices" (Oregon Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,347, issued on June 30, was assigned to Intel Corp. (Santa Clara, Calif.). "Lower device access in stacked transistor devices" was invented... Read More


US Patent Issued to SAMSUNG ELECTRONICS on June 30 for "Semiconductor devices" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,348, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor devices" was invented by Jungg... Read More


US Patent Issued to Intel on June 30 for "Device, method and system to provide an interconnect between channel structures" (Oregon Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,349, issued on June 30, was assigned to Intel Corp. (Santa Clara, Calif.). "Device, method and system to provide an interconnect between ch... Read More