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US Patent Issued to ADVANCED MICRO DEVICES on Aug. 25 for "Structural thermal interfacing for lidded semiconductor packages" (California, Texas Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,159, issued on Aug. 25, was assigned to ADVANCED MICRO DEVICES INC. (Santa Clara, Calif.). "Structural thermal interfacing for lidded semic... और पढ़ें


US Patent Issued to STMicroelectronics International on Aug. 25 for "Thermally enhanced flip chip ball grid array package with improved heat dissipation" (French Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,160, issued on Aug. 25, was assigned to STMicroelectronics International N.V. (Geneva). "Thermally enhanced flip chip ball grid array packa... और पढ़ें


US Patent Issued to SJ Semiconductor(Jiangyin) on Aug. 25 for "Thermally conductive semiconductor packaging structure and method for preparing same" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,161, issued on Aug. 25, was assigned to SJ Semiconductor(Jiangyin) Corp. (Jiangyin City, China). "Thermally conductive semiconductor packag... और पढ़ें


US Patent Issued to Mitsubishi Electric on Aug. 25 for "Power semiconductor device, method for manufacturing same, and power conversion device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,162, issued on Aug. 25, was assigned to Mitsubishi Electric Corp. (Tokyo). "Power semiconductor device, method for manufacturing same, and ... और पढ़ें


US Patent Issued to DENSO on Aug. 25 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,163, issued on Aug. 25, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor device" was invented by Keisuke Nakano (Kariya-cit... और पढ़ें


US Patent Issued to Mitsubishi Electric on Aug. 25 for "Semiconductor device having a plurality of circuit patterns on a resin insulating layer" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,164, issued on Aug. 25, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device having a plurality of circuit patterns on ... और पढ़ें


US Patent Issued to INVENTION AND COLLABORATION LABORATORY on Aug. 25 for "Semiconductor circuit structure with direct die heat removal structure" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,165, issued on Aug. 25, was assigned to INVENTION AND COLLABORATION LABORATORY INC. (Taipei City, Taiwan). "Semiconductor circuit structure... और पढ़ें


US Patent Issued to Lenovo (Singapore) on Aug. 25 for "Controlling an iron slurry in semiconductor assembly" (North Carolina Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,166, issued on Aug. 25, was assigned to Lenovo (Singapore) Pte. Ltd. (Singapore). "Controlling an iron slurry in semiconductor assembly" wa... और पढ़ें


US Patent Issued to TDK ELECTRONICS on Aug. 25 for "Cooling system" (Austrian Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,167, issued on Aug. 25, was assigned to TDK ELECTRONICS AG (Munich). "Cooling system" was invented by Markus Koini (Seiersberg, Austria), M... और पढ़ें


US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Aug. 25 for "Direct substrate-side cooling in power device module" (Chinese, Malaysian, Thai Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,168, issued on Aug. 25, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.). "Direct substrate-side cooling in powe... और पढ़ें