US Patent Issued to Mitsubishi Electric on Aug. 25 for "Semiconductor device having a plurality of circuit patterns on a resin insulating layer" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,164, issued on Aug. 25, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device having a plurality of circuit patterns on a resin insulating layer" was invented by Shintaro Araki (Tokyo), Naoki Yoshimatsu (Tokyo) and Kazuhiro Nishimura (Fukuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a metal block; a semiconductor element fixed to an upper surface of the block with a first joining material; a main terminal fixed to an upper surface of the element with a second joining material; a signal terminal electrically connected to the element; and a mold resin covers the element, the first and se...