US Patent Issued to DENSO on Aug. 25 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,163, issued on Aug. 25, was assigned to DENSO Corp. (Kariya-city, Japan).

"Semiconductor device" was invented by Keisuke Nakano (Kariya-city, Japan) and Tomomi Okumura (Kariya-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor element having main electrodes on opposite faces opposite in a predetermined direction, a substrate, and a sealing body containing resin. The substrate has an insulating base member, a front-face metal body on a front face of the insulating base member and a back-face metal body on a back face of the insulating base member, the front-face metal body being connected to at ...