US Patent Issued to STMicroelectronics International on Aug. 25 for "Thermally enhanced flip chip ball grid array package with improved heat dissipation" (French Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,160, issued on Aug. 25, was assigned to STMicroelectronics International N.V. (Geneva).

"Thermally enhanced flip chip ball grid array package with improved heat dissipation" was invented by Florian Perminjat (Saint Romans, France) and Fabrice De Moro (Saint Verand, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit package includes a support substrate with front connection pads on a front surface thereof and rear connection pads on a rear surface thereof. An integrated circuit device is mounted to the support substrate in flip chip orientation with a front face of the integrated circuit device facing the front surface of the...