US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Aug. 25 for "Direct substrate-side cooling in power device module" (Chinese, Malaysian, Thai Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,168, issued on Aug. 25, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Direct substrate-side cooling in power device module" was invented by Atapol Prajuckamol (Thanyaburi, Thailand), Chee Hiong Chew (Seremban, Malaysia) and Yushuang Yao (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes disposing at least one power device between a first direct bonded metal (DBM) substrate and a second DMB substrate and thermally coupling a plurality of pipes to a top side of the first DBM substrate opposite a side of the first DBM substrate with the at least one power device. The plurality of pipes is c...