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US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Semiconductor structures with through via" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,138, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structures with t... और पढ़ें


US Patent Issued to NANYA TECHNOLOGY on Aug. 25 for "Contact structure, semiconductor device with the same, and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,139, issued on Aug. 25, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Contact structure, semiconductor device with the... और पढ़ें


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Semiconductor device structure and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,140, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device structure ... और पढ़ें


US Patent Issued to Renesas Electronics on Aug. 25 for "Semiconductor device and method of manufacturing the same" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,141, issued on Aug. 25, was assigned to Renesas Electronics Corp. (Tokyo). "Semiconductor device and method of manufacturing the same" was ... और पढ़ें


US Patent Issued to INTERNATIONAL BUSINESS MACHINES on Aug. 25 for "Isolated super via to middle metal line level" (New York Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,142, issued on Aug. 25, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Isolated super via to middle metal line leve... और पढ़ें


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Hybrid method for forming semiconductor interconnect structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,143, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD (Hsinchu, Taiwan). "Hybrid method for forming semiconduc... और पढ़ें


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Semiconductor device with polygonal inductive device" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,144, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device with polyg... और पढ़ें


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Semiconductor device and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,145, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device and method... और पढ़ें


US Patent Issued to NANYA TECHNOLOGY on Aug. 25 for "Semiconductor device and method of manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,146, issued on Aug. 25, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device and method of manufacturing... और पढ़ें


US Patent Issued to International Business Machines on Aug. 25 for "Direct backside contact with replacement backside dielectric" (New York Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,147, issued on Aug. 25, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Direct backside contact with replacement bac... और पढ़ें