ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,066, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Aluminum nitride dipole dopant film... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,067, issued on Aug. 25, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Titanium nitride gapfill processes for semiconductor... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,068, issued on Aug. 25, was assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (Paris). "Method for producing a mic... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,069, issued on Aug. 25, was assigned to STMicroelectronics International N.V. (Geneva). "Process for manufacturing localized ion implants i... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,070, issued on Aug. 25, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Ion beam implantation method and semiconductor devi... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,071, issued on Aug. 25, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Selectivity of boron hard masks using ion implant" w... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,072, issued on Aug. 25, was assigned to DISCO Corp. (Tokyo). "Processing method of bonded wafer" was invented by Hayato Tanaka (Tokyo) and ... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,073, issued on Aug. 25, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Method of manufacturing semiconductor device and semicon... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,074, issued on Aug. 25, was assigned to United Microelectronics Corp. (Hsinchu, Taiwan). "Patterning method" was invented by Yi Lin Tsai (T... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,075, issued on Aug. 25, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Method of manufacturing semiconductor device" was invent... Read More