ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,772, issued on Aug. 25, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Hybrid memory on front and backside of a waf... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,773, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package" was invented by Ja... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,774, issued on Aug. 25, was assigned to QUALCOMM Inc. (San Diego). "Device having an in-substrate inductor and method for making the induct... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,775, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Packages with chips comprising indu... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,776, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Deep trench resistor structure ... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,777, issued on Aug. 25, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Resistor structure in integrated circuit" wa... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,778, issued on Aug. 25, was assigned to Intel Corp. (Santa Clara, Calif.). "Integrated circuits with high dielectric constant interfacial l... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,779, issued on Aug. 25, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure and method of forming th... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,780, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Schottky barrier diode (SBD) leakag... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,781, issued on Aug. 25, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Semiconductor device and related chip and prepara... Read More