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US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on Nov. 3 for "Semiconductor device and manufacturing method thereof" (Chinese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,334, issued on Nov. 3, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Semiconductor device and manufacturing method... Read More


US Patent Issued to International Business Machines on Nov. 3 for "Scanning single electron transistor having a plunger gate over fin" (Swiss Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,335, issued on Nov. 3, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Scanning single electron transistor having a p... Read More


US Patent Issued to Applied Materials on Nov. 3 for "Isolation module for backside power delivery" (California, New Jersey, New York, Massachusetts Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,336, issued on Nov. 3, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Isolation module for backside power delivery" was inve... Read More


US Patent Issued to Industry-University Cooperation Foundation Hanyang University ERICA CAMPUS, Ajou University Industry-Academic Cooperation Foundation on Nov. 3 for "Electronic device" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,337, issued on Nov. 3, was assigned to Industry-University Cooperation Foundation Hanyang University ERICA CAMPUS (Gyeonggi-do, South Korea) ... Read More


US Patent Issued to INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS, AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION on Nov. 3 for "Electronic device" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,338, issued on Nov. 3, was assigned to INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS (Gyeonggi-do, South Korea) ... Read More


US Patent Issued to Intel on Nov. 3 for "Technologies for atomic layer deposition for ferroelectric transistors" (Oregon, Washington Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,339, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Technologies for atomic layer deposition for ferroelectric transi... Read More


US Patent Issued to 1FINITY on Nov. 3 for "Semiconductor device, semiconductor device manufacturing method, and electronic device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,340, issued on Nov. 3, was assigned to 1FINITY Inc. (Kawasaki, Japan). "Semiconductor device, semiconductor device manufacturing method, and... Read More


US Patent Issued to ROHM on Nov. 3 for "Nitride semiconductor device and method for manufacturing nitride semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,341, issued on Nov. 3, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Nitride semiconductor device and method for manufacturing nitride semi... Read More


US Patent Issued to TAIWAN-ASIA SEMICONDUCTOR on Nov. 3 for "High electron mobility transistor" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,342, issued on Nov. 3, was assigned to TAIWAN-ASIA SEMICONDUCTOR Corp. (Hsinchu City, Taiwan). "High electron mobility transistor" was inven... Read More


US Patent Issued to Transphorm Technology on Nov. 3 for "N-polar devices including a depleting layer with improved conductivity" (California Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,343, issued on Nov. 3, was assigned to Transphorm Technology Inc. (Goleta, Calif.). "N-polar devices including a depleting layer with improv... Read More