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US Patent Issued to Amkor Technology Singapore Holding on Sept. 22 for "Electronic devices and methods of manufacturing electronic devices" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,629, issued on Sept. 22, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Electronic devices and methods of manu... Read More


US Patent Issued to SILICONWARE PRECISION INDUSTRIES on Sept. 22 for "Electronic package with improved heat dissipating and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,630, issued on Sept. 22, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package with impro... Read More


US Patent Issued to STMicroelectronics (Grenoble 2) on Sept. 22 for "Integrated circuit package" (French Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,631, issued on Sept. 22, was assigned to STMicroelectronics (Grenoble 2) SAS (Grenoble, France). "Integrated circuit package" was invented... Read More


US Patent Issued to Sandisk Technologies on Sept. 22 for "Memory device and method of assembling same" (Malaysian Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,632, issued on Sept. 22, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Memory device and method of assembling same" was i... Read More


US Patent Issued to MITSUBISHI ELECTRIC on Sept. 22 for "Semiconductor module and power converter" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,633, issued on Sept. 22, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo). "Semiconductor module and power converter" was invented by Sho... Read More


US Patent Issued to FUJI ELECTRIC on Sept. 22 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,635, issued on Sept. 22, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor device" was invented by Sota Yamaguchi (... Read More


US Patent Issued to Marel Power Solutions on Sept. 22 for "Liquid cooled compact power systems" (Michigan Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,636, issued on Sept. 22, was assigned to Marel Power Solutions (Plymouth, Mich.). "Liquid cooled compact power systems" was invented by Ia... Read More


US Patent Issued to Huawei Digital Power Technologies on Sept. 22 for "Power semiconductor module and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,637, issued on Sept. 22, was assigned to Huawei Digital Power Technologies Co. Ltd. (Shenzhen, China). "Power semiconductor module and man... Read More


US Patent Issued to Frore Systems on Sept. 22 for "Piezoelectric MEMS-based active cooling for heat dissipation in compute devices" (California Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,638, issued on Sept. 22, was assigned to Frore Systems Inc. (San Jose, Calif.). "Piezoelectric MEMS-based active cooling for heat dissipat... Read More


US Patent Issued to Board Of Trustees Of The University Of Arkansas on Sept. 22 for "Apparatus and method to reduce the thermal resistance of semiconductor substrates" (Arkansas Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,639, issued on Sept. 22, was assigned to Board Of Trustees Of The University Of Arkansas (Little Rock, Ark.). "Apparatus and method to red... Read More