US Patent Issued to STMicroelectronics (Grenoble 2) on Sept. 22 for "Integrated circuit package" (French Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,631, issued on Sept. 22, was assigned to STMicroelectronics (Grenoble 2) SAS (Grenoble, France).

"Integrated circuit package" was invented by Younes Boutaleb (Grenoble, France) and Julien Cuzzocrea (Montbonnot Saint Martin, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit package includes a base substrate with at least one electronic chip mounted on a face of the base substrate. The electronic chip is configured to have hot spots in operation emitting heat in a heat volume space. A coating encapsulates the at least one electronic chip. The coating has a bottom face mounted on the face of the base substrate and a profiled ...