US Patent Issued to HKC on Nov. 3 for "Array substrate and display panel" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,443, issued on Nov. 3, was assigned to HKC CORPORATION LIMITED (Shenzhen, China). "Array substrate and display panel" was invented by Xin Yu... Read More

US Patent Issued to Beijing BOE Display Technology, Beijing BOE Technology Development on Nov. 3 for "Array substrate and display apparatus" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,444, issued on Nov. 3, was assigned to Beijing BOE Display Technology Co. Ltd. (Beijing) and Beijing BOE Technology Development Co. Ltd. (Bei... Read More

US Patent Issued to Sharp on Nov. 3 for "Active matrix substrate and display device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,445, issued on Nov. 3, was assigned to Sharp K.K. (Sakai City, Japan). "Active matrix substrate and display device" was invented by Kengo Ha... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Layout design methodology for stacked devices" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,446, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hshinch, Taiwan). "Layout design methodology for stacked... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 3 for "Integrated circuit and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,447, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Integrated circuit and method of ... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 3 for "Protection circuit" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,448, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Protection circuit" was invented by C... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Embedded clamping diode to improve device ruggedness" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,449, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Embedded clamping diode to improve de... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "VT1 reduction using vertical NPN" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,450, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "VT1 reduction using vertical NPN" was... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Protection of integrated circuit from ESD and PID risks" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,451, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Protection of integrated circuit from... Read More

US Patent Issued to TONGWEI SOLAR (CHENGDU) on Nov. 3 for "Photovoltaic module, preparation method thereof and photovoltaic power generation apparatus" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,453, issued on Nov. 3, was assigned to TONGWEI SOLAR (CHENGDU) Co. LTD. (Chengdu, China). "Photovoltaic module, preparation method thereof a... Read More

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