US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 3 for "Integrated circuit and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,447, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Integrated circuit and method of forming the same" was invented by Kuang-Ching Chang (Hsinchu, Taiwan), Jung-Chan Yang (Hsinchu, Taiwan), Hui-Zhong Zhuang (Hsinchu, Taiwan), Chih-Liang Chen (Hsinchu, Taiwan) and Kuo-Nan Yang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit includes a first and a second power rail on a back-side of a wafer and configured to supply a first voltage, a footer circuit coupled to the first and the second power rail, and configured to receive a second supply voltage, and to supply t...