ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,715, issued on April 14, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan). "Isolation structure and memory device" was in... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,715, issued on April 14, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan). "Isolation structure and memory device" was in... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,716, issued on April 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Interconnect with two-dimensional free zer... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,716, issued on April 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Interconnect with two-dimensional free zer... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,717, issued on April 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure and method of manufact... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,717, issued on April 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure and method of manufact... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,718, issued on April 14, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Memory device and method of manufacturing the same" was ... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,718, issued on April 14, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Memory device and method of manufacturing the same" was ... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,719, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device having a through-via ... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,719, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device having a through-via ... और पढ़ें