US Patent Issued to SAMSUNG ELECTRONICS on Aug. 18 for "Semiconductor manufacturing apparatus" (South Korean Inventors)

Posted On: 2026-08-18

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,878, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor manufacturing apparatus" was i... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 18 for "System and method for detecting semiconductor processing error" (Taiwanese Inventors)

Posted On: 2026-08-18

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ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,879, issued on Aug. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan). "System and method for detecting se... Read More

US Patent Issued to CANON on Aug. 18 for "Bonding apparatus, bonding method, estimation method, and article manufacturing method" (Japanese Inventor)

Posted On: 2026-08-18

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ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,880, issued on Aug. 18, was assigned to CANON K.K. (Tokyo). "Bonding apparatus, bonding method, estimation method, and article manufacturin... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Photoresist having strengthening material" (Taiwanese Inventors)

Posted On: 2026-08-18

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ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,881, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Photoresist having strengthenin... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 18 for "Semiconductor device including gate lines with a conductive layer having less nitrogen than an interface layer and method of fabricating the same" (South Korean Inventors)

Posted On: 2026-08-18

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ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,882, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device including gate lines... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Semiconductor device structure and methods of forming the same" (Taiwanese Inventors)

Posted On: 2026-08-18

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ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,883, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device structure ... Read More

US Patent Issued to Tokyo Electron on Aug. 18 for "Back end of line (BEOL) interconnection approach" (New York Inventors)

Posted On: 2026-08-18

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ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,884, issued on Aug. 18, was assigned to Tokyo Electron Ltd. (Tokyo). "Back end of line (BEOL) interconnection approach" was invented by Pen... Read More

US Patent Issued to KIOXIA on Aug. 18 for "Semiconductor device manufacturing method" (Japanese Inventor)

Posted On: 2026-08-18

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ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,885, issued on Aug. 18, was assigned to KIOXIA Corp. (Tokyo). "Semiconductor device manufacturing method" was invented by Kazuhiro Takahata... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 18 for "Semiconductor devices and method of manufacturing the same" (South Korean Inventors)

Posted On: 2026-08-18

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ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,886, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor devices and method of manufact... Read More

US Patent Issued to Lam Research on Aug. 18 for "Method of forming expandable doped oxide films for advanced semiconductor applications" (Oregon Inventor)

Posted On: 2026-08-18

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ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,887, issued on Aug. 18, was assigned to Lam Research Corp. (Fremont, Calif.). "Method of forming expandable doped oxide films for advanced ... Read More

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US Patent Issued to SAMSUNG ELECTRONICS on Aug. 18 for "Semiconductor manufacturing apparatus" (South Korean Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 18 for "System and method for detecting semiconductor processing error" (Taiwanese Inventors)

US Patent Issued to CANON on Aug. 18 for "Bonding apparatus, bonding method, estimation method, and article manufacturing method" (Japanese Inventor)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Photoresist having strengthening material" (Taiwanese Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 18 for "Semiconductor device including gate lines with a conductive layer having less nitrogen than an interface layer and method of fabricating the same" (South Korean Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Semiconductor device structure and methods of forming the same" (Taiwanese Inventors)

US Patent Issued to Tokyo Electron on Aug. 18 for "Back end of line (BEOL) interconnection approach" (New York Inventors)

US Patent Issued to KIOXIA on Aug. 18 for "Semiconductor device manufacturing method" (Japanese Inventor)

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 18 for "Semiconductor devices and method of manufacturing the same" (South Korean Inventors)

US Patent Issued to Lam Research on Aug. 18 for "Method of forming expandable doped oxide films for advanced semiconductor applications" (Oregon Inventor)