US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Photoresist having strengthening material" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,881, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Photoresist having strengthening material" was invented by Yuan Chih Lo (Hsinchu City, Taiwan), Shi-Cheng Wang (Tainan City, Taiwan), Cheng-Han Wu (Taichung City, Taiwan) and Ching-Yu Chang (Yilang County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device includes forming a photoresist layer over a substrate, exposing the photoresist layer to an EUV radiation, developing the photoresist layer to form a patterned photoresist, forming a coating layer on the patterned photoresist, and after for...