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US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Pick-and-place tool and method of manufacturing semiconductor structure" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,868, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Pick-and-place tool and method ... Read More


US Patent Issued to Elemental Scientific on Aug. 18 for "Systems for integrated decomposition and scanning of a semiconducting wafer" (American, South Korean Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,869, issued on Aug. 18, was assigned to Elemental Scientific Inc. (Omaha, Neb.). "Systems for integrated decomposition and scanning of a se... Read More


US Patent Issued to Axcelis Technologies on Aug. 18 for "System and method of verifying workpiece alignment" (Massachusetts Inventor)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,870, issued on Aug. 18, was assigned to Axcelis Technologies Inc. (Beverly, Mass.). "System and method of verifying workpiece alignment" wa... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 18 for "Systems and methods for semiconductor wafer transport" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,871, issued on Aug. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Systems and methods for semiconduct... Read More


US Patent Issued to Micron Technology on Aug. 18 for "Apparatus and method for characterization and optional sorting and assembly of microelectronic components according to warpage" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,872, issued on Aug. 18, was assigned to Micron Technology Inc. (Boise, Idaho). "Apparatus and method for characterization and optional sort... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Container for receiving semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,873, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Container for receiving semicon... Read More


US Patent Issued to Sinfonia Technology on Aug. 18 for "EFEM and method of controlling supply amount of inert gas" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,874, issued on Aug. 18, was assigned to Sinfonia Technology Co. Ltd. (Tokyo). "EFEM and method of controlling supply amount of inert gas" w... Read More


US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on Aug. 18 for "Method and apparatus for wafer bonding" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,875, issued on Aug. 18, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China). "Method and apparatus for wafer bonding" was i... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "System and method for cleaning a wafer surface" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,876, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "System and method for cleaning ... Read More


US Patent Issued to APET on Aug. 18 for "Chuck assembly" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,877, issued on Aug. 18, was assigned to APET Co. LTD. (Pyeongtaek-si, South Korea). "Chuck assembly" was invented by Tae Woo Kim (Hwaseong-... Read More