US Patent Issued to Micron Technology on Aug. 18 for "Apparatus and method for characterization and optional sorting and assembly of microelectronic components according to warpage" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,872, issued on Aug. 18, was assigned to Micron Technology Inc. (Boise, Idaho).

"Apparatus and method for characterization and optional sorting and assembly of microelectronic components according to warpage" was invented by Kuan Wei Tseng (Taichung City, Taiwan), Deepti Verma (Boise, Idaho), Tzu Hsien Yu (Taichung City, Taiwan) and Brandon P. Wirz (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "This application relates to a method of processing microelectronic components comprising measuring parameter values of at least one of a nature and a degree of warpage of singulated microelectronic components in an unconstrained state and sorting...