US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Pick-and-place tool and method of manufacturing semiconductor structure" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,868, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Pick-and-place tool and method of manufacturing semiconductor structure" was invented by Jen-Yuan Chang (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A pick-and-place tool includes a bond base and an attaching head. The attaching head is connected to the bond base and configured to attract a chip by a suction force. The attaching head has an attaching surface that is convex toward the chip, the attaching head has a plurality of suction holes penetrating the attaching surface, and the attaching head attracts the chip usin...