ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,858, issued on Aug. 18, was assigned to DISCO Corp. (Tokyo). "Wafer processing method" was invented by Hayato Iga (Tokyo) and Kazuya Hirata... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,859, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Wafer thinning method having fe... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,860, issued on Aug. 18, was assigned to HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan). "Laser processing method" was invented by Takeshi Saka... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,861, issued on Aug. 18, was assigned to DISCO Corp. (Tokyo). "Method of processing SiC wafer" was invented by Akifumi Suzuki (Tokyo) and Ju... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,862, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Cover assembly of semiconductor... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,863, issued on Aug. 18, was assigned to SEMES Co. LTD. (Chungcheongnam-do, South Korea). "Substrate treatment apparatus and method" was inv... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,864, issued on Aug. 18, was assigned to Lam Research Corp. (Fremont, Calif.). "Plasma etching chemistries of high aspect ratio features in ... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,865, issued on Aug. 18, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing apparatus and substrate processing method" was i... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,866, issued on Aug. 18, was assigned to Board of Regents, The University of Texas System (Austin, Texas). "Equipment and process technologi... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,867, issued on Aug. 18, was assigned to SEMES Co. LTD. (Chungcheongnam-Do, South Korea). "Substrate treating apparatus and substrate treati... Read More