ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,862, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Cover assembly of semiconductor manufacturing tool" was invented by Yung-Tsun Liu (Taipei City, Taiwan), Sung-Ju Huang (Taipei City, Taiwan) and Kuang-Wei Cheng (Hsinchu City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A gas intake apparatus, configured to provide a gas to flow into an interior space a cover that covers a process chamber cap of a semiconductor manufacturing tool is provided. In one embodiment, the gas intake apparatus comprises a deflector configured to be positioned on a sidewall of the cover and a fan device confi...