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US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Semiconductor system inspection tool and methods of operation" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,679, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor system inspection too... और पढ़ें


US Patent Issued to Applied Materials on July 14 for "Low-k RF rod for RF bias power delivery" (American, Indian Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,680, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Low-k RF rod for RF bias power delivery" was invente... और पढ़ें


US Patent Issued to Halliburton Energy Services on July 14 for "Target gas loading for neutron generator" (Texas Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,681, issued on July 14, was assigned to Halliburton Energy Services Inc. (Houston). "Target gas loading for neutron generator" was invented... और पढ़ें


US Patent Issued to CANON on July 14 for "Electronic apparatus and image pickup apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,682, issued on July 14, was assigned to CANON K.K. (Tokyo). "Electronic apparatus and image pickup apparatus" was invented by Honkai Tomimo... और पढ़ें


US Patent Issued to MURATA MANUFACTURING on July 14 for "Radio frequency module, communication device, and filter" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,683, issued on July 14, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Radio frequency module, communication device, and fi... और पढ़ें


US Patent Issued to KYOCERA on July 14 for "Wiring board and electronic device" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,684, issued on July 14, was assigned to KYOCERA Corp. (Kyoto, Japan). "Wiring board and electronic device" was invented by Yoshiki Kawazu (... और पढ़ें


US Patent Issued to Intel on July 14 for "Cooling assembly with dampened oscillation response" (Washington, Oregon Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,685, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Cooling assembly with dampened oscillation response" was invent... और पढ़ें


US Patent Issued to IBIDEN on July 14 for "Wiring substrate" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,686, issued on July 14, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate" was invented by Masataka Kato (Ogaki, Japan), Sh... और पढ़ें


US Patent Issued to Intel on July 14 for "Circuit apparatus for electronic devices" (Malaysian, Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,687, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Circuit apparatus for electronic devices" was invented by Jeff ... और पढ़ें


US Patent Issued to TDK on July 14 for "Electronic component embedded substrate and manufacturing method therefor" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,688, issued on July 14, was assigned to TDK Corp. (Tokyo). "Electronic component embedded substrate and manufacturing method therefor" was ... और पढ़ें