ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,103, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Metal wires with expanded sidewalls" was inv... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,104, issued on July 14, was assigned to STMicroelectronics (Rousset) SAS (Rousset, France). "Contact for electronic component" was invented... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,105, issued on July 14, was assigned to HON HAI PRECISION INDUSTRY Co. LTD. (New Taipei City, Taiwan). "Forming method of interconnect stru... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,106, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and NATIONAL YANG MING CHIAO TUNG ... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,108, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Method to improve interconnect coefficient of therma... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,109, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device and manufa... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,110, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Octagonal interconnect wiring for advanced l... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,111, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Semiconductor structures including metal wir... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,112, issued on July 14, was assigned to Adeia Semiconductor Solutions LLC (San Jose, Calif.). "Method of forming copper interconnect struct... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,114, issued on July 14, was assigned to Fujian Jinhua Integrated Circuit Co. Ltd. (Quanzhou City, China). "Contact pad structure and manufa... और पढ़ें