US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING, NATIONAL YANG MING CHIAO TUNG UNIVERSITY on July 14 for "Package structure and method for fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,106, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and NATIONAL YANG MING CHIAO TUNG UNIVERSITY (Hsinchu City, Taiwan).

"Package structure and method for fabricating the same" was invented by Chih Chen (Hsinchu City, Taiwan), Pin-Syuan He (Taichung City, Taiwan) and Kai-Cheng Shie (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a first conductive feature over a first semiconductor structure; forming a first dielectric layer over the first conductive feature and the first semiconductor structure; removing a portion of the first dielectric layer to e...