US Patent Issued to HON HAI PRECISION INDUSTRY on July 14 for "Forming method of interconnect structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,105, issued on July 14, was assigned to HON HAI PRECISION INDUSTRY Co. LTD. (New Taipei City, Taiwan).

"Forming method of interconnect structure" was invented by Yun-Hung Shen (Hsinchu City, Taiwan) and Chien-Jung Yang (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a forming method of an interconnect structure. The method includes forming a multilayer stack on a substrate including a wiring layer, where the multilayer stack includes an extreme low-k dielectric layer above the wiring layer and a mask layer above the extreme low-k dielectric layer. The method also includes etching the multilayer st...