US Patent Issued to Applied Materials on July 14 for "Method to improve interconnect coefficient of thermal expansion" (New York, California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,108, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Method to improve interconnect coefficient of thermal expansion" was invented by Tyler Sherwood (Fonda, N.Y.) and Raghav Sreenivasan (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present technology includes semiconductor processing methods and devices with improved expansion of the bulk material in substrate features. Methods include cleaning a substrate that is formed from silicon oxide and that defines one or more features and that includes a liner that extends across the silicon oxide and within one or more features and a copper-containing...