ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,110, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.).
"Octagonal interconnect wiring for advanced logic" was invented by Oscar van der Straten (Guilderland Center, N.Y.), Scott A. DeVries (Albany, N.Y.), Koichi Motoyama (Clifton Park, N.Y.) and Chih-Chao Yang (Glenmont, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip is manufactured using a method for forming a back-end-of-line (BEOL) layer on an IC chip surface comprises providing a first layer on top of a substrate layer of the IC chip, the first layer comprising a bottom portion of a metallic fill region having a first width as seen in a vertical...