Publication

Byline

Location

US Patent Issued to Winbond Electronics on July 28 for "Semiconductor structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,440, issued on July 28, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan). "Semiconductor structure and method of manufactu... और पढ़ें


US Patent Issued to WINBOND ELECTRONICS on July 28 for "Semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,441, issued on July 28, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan). "Semiconductor structure" was invented by Kai Je... और पढ़ें


US Patent Issued to BEIJING SUPERSTRIG ACADEMY OF MEMORY TECHNOLOGY on July 28 for "Memory, and method for manufacturing memory" (Chinese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,442, issued on July 28, was assigned to BEIJING SUPERSTRIG ACADEMY OF MEMORY TECHNOLOGY (Beijing). "Memory, and method for manufacturing me... और पढ़ें


US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on July 28 for "Semiconductor structure and preparation method thereof" (Chinese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,443, issued on July 28, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Semiconductor structure and preparation met... और पढ़ें


US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on July 28 for "Memory including zigzag bit lines and method for manufacturing same" (Chinese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,444, issued on July 28, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Memory including zigzag bit lines and metho... और पढ़ें


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 28 for "Integrated circuit with back-side metal line, method of fabricating the same, and layout method" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,445, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Integrated circuit with back-si... और पढ़ें


US Patent Issued to Micron Technology on July 28 for "Microelectronic devices with support pillars spaced along a slit region between pillar array blocks" (Idaho Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,446, issued on July 28, was assigned to Micron Technology Inc. (Boise, Idaho). "Microelectronic devices with support pillars spaced along a... और पढ़ें


US Patent Issued to SK hynix on July 28 for "Semiconductor device and manufacturing method thereof" (South Korean Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,447, issued on July 28, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Semiconductor device and manufacturing method thereof" was... और पढ़ें


US Patent Issued to Kioxia on July 28 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,448, issued on July 28, was assigned to Kioxia Corp. (Tokyo). "Semiconductor device" was invented by Ken Komiya (Nagoya Aichi, Japan). Acc... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor devices and data storage systems including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,449, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor devices and data storage syste... और पढ़ें