US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 28 for "Integrated circuit with back-side metal line, method of fabricating the same, and layout method" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,445, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Integrated circuit with back-side metal line, method of fabricating the same, and layout method" was invented by Chien-Ying Chen (Hsinchu, Taiwan) and Yao-Jen Yang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of generating an integrated circuit (IC) layout diagram includes overlapping an active region with a plurality of gate regions, thereby defining a program transistor and a read transistor of a one-time-programmable (OTP) bit, overlapping a through via region with a gate region of the plurality of gate regions o...